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首页 > 产品展示 > 锡铅系列

免清洗焊锡丝

我公司依据中华人民共和国电子行业标准SJ/T 11168-98《免清洗焊接用焊锡丝》生产的免清洗焊锡丝,满足了高密度、高可靠性电子产品的免清洗组装工艺,具有焊点光亮可靠、清洁美观、焊后绝缘电阻高、离子污染度低等特点,焊后PCB版面清洁残留物极少,无需清洗即达到免清洗工艺规范。我公司有各种含锡量和线径的免清洗焊锡丝供选择。

According to the standard for electronics industry of PBC, SJ/T11168-1998《Solder wire for soldering cleanout-free》, the rosin cored solder wires & special soldering wires made by our company can meet the needs of assembling and packaging technologies for high-density and high-reliability electronic devices. The soldered joints are qualified for bright, reliable, clean, beautiful, higher insulation resistance, lower ionic contamination, and fewer residua on as-soldered PCB board, which meet the demands of related specification with no-clean technology. Our company offers variety choices for the tin contents and diameters of no-clean solder wires.

树脂芯活性焊锡丝

采用高品质树脂——松香加之专业研究的高技术含量活化剂,生产的树脂芯焊锡丝中的助焊剂共分为R型(非活化)、RMA型(中度活化)、RA型(高度活化)三类产品,各类焊锡丝具有焊接速度快、焊点圆整光亮、飞溅少、焊点可靠、用途广泛等特点。产品各项技术指标优良,本公司备有多重合金比例和线径供客户选择。

产品执行标准:GB/T3131-2001

By using hith-quality resin-rosin, combined with newly developed high-tech activators, our company can supply three type of products, e.g. R-type(non-activated),RMA type(middle activation) and RA type (highly activated). All kinds of solder wires are qualified for a fast soldering speed, sound bright joint, fewer soldering spatters, reliable soldered joint, which found a wide application in industry. With the excellent technical indicators, Our company offers variety choices of the alloy proportion of the solders and diameter for the customers.

Standard followed by our product:GB/T3131-2001

电容器专用焊锡丝

针对电容器焊接工艺专门研究的焊锡丝,在电容器端面喷硒-Zn层及低熔点喷金层上直接实现焊接,具有焊接速度快、不伤底膜、接头可靠、与电容器介质互溶性好、电容损耗角小等特点,被广泛应用于电容器制造行业并得到客户的一致赞誉。

电容器专用焊锡丝的牌号:Sn45PbA、Sn50PbA、Sn55PbA

Aimed at soldering process for capacitors, in order to directly solder at the capacitor end face sprayed Zn layer as well as the low melting spray alloy layer, our company developed the special solders, which are characterized by fast soldering speed, reliable joint, good mutual solubility with the capacitor dielectric materials and small capacitance loss angle, especially can avoid hurting the end of film, so that they are widely used in the capacitor maunfacturing industry and got high praise from our customers.

Special solder types for capacitors:Sn45PbA, Sn50PbA,Sn55PbA

水溶性焊锡丝

符合当今取消ODS物质的使用,保护人类环境,适用于电子产品生产的水清洗工艺流程,焊后残留物极易用温水清洗,更符合当今环保要求。

In order to meet the needs of inhibition of Ozone Depleting Substances (ODS) and protection of the environment, the water-soluble solder wires were developed by our company, which are suitable for manufacturing electronic products, and the residua are easy to clean by hot water, in which it fits taday's requirements of environmental protection.

不锈钢用焊锡丝

本公司生产的不锈钢焊锡丝适用于304、306、1Cr18Ni9Ti牌号的不锈钢-不锈钢、不锈钢-铜异种金属间的软钎焊,焊后残渣易用水清洗。本公司优先推荐含锡量为Sn45~Sn63%的不锈钢用焊锡丝。

Our company provides the solder wires such as soldering 304, 306 and 1Cr18Ni9Ti to stainless-steel, soldering stainless steel to copper soldering etc, which the residua are easy to clean. Our company strongly recommends the solder wires bearing tin of Sn45~Sn63%.

铝及铝合金专用焊锡丝

我公司研发的铝灯头焊锡丝具有在铝和铝合金材质上润湿性好、上焊速度快、焊点可靠饱满、残渣无腐蚀等特点,已广泛应用于铝质灯头照明灯具制造、铝漆包线变压器制造中。可供规格Ф0.8~Ф2.5mm以适应不同的生产流水线送丝焊接工艺。产品有0.5Kg/卷、1.0Kg/卷、5.0Kg/卷等规格。

Solder wires made by our company for aluminum lamp holder are qualified for excellent solderability to aluminum alloys such as aluminum lamp holder, fast soldering speed, reliable soldered joint, non-corrosive residua, etc., which have been found wide application in soldering aluminum lamp holder and aluminum enameled wires in transformer. Specifications of Ф0.8~Ф2.5mm are available to be choosen to meet the needs of different production lines and/or soldering process. Product weight: 0.5kg/roll, 1.0kg/roll, 5.0kg/roll.

*华银牌树脂芯焊锡丝和特种焊接焊锡丝执行标准;GB/T3131-2001、SJ/T 11168-1998

Standard followed by our product: GB/T 3131-2001, SJ/T 11168-1998

锡铅焊锡膏

焊锡条

我公司生产的各种成分的焊锡条符合GB/T 8012-2000 标准规范,全部焊锡条产品全部采用了高品质的纯金属、先进的熔炼工艺和防氧化技术,在严格的管控下制作,将对焊接的有害元素如:铜、锌、铝、镉、铁、硫、砷和氧化物控制至最低。产品具有流动性好、润湿时间短、上焊速度快、焊点致密光亮、氧化物极少等特点。

华银牌焊锡条从抗氧化温度能力范围区分为: HY-1型抗氧化焊锡条、HY-2型抗氧化焊锡条二种型号的产品,我公司备有各种合金成分的焊锡条供您选择。

产品执行标准: GB/T 8012-2000

All solders made by our company meet the requirements of GB/T 8012-2000 standard, which made from high quality raw materials as well as advanced smelting technology and anti-oxidation technology. By means of strict and sound management approaches and quality control methods, the harmful elements and substances, such as copper, zinc, aluminum, cadmium, iron, sulfur, arsenic and oxides are reduced to a minimum level, which all products are qualified for good fluidity, short wetting time, fast soldering speed, dense bright joint, fewer oxides and so on.

Huayin band solder bars are divided into two kinds of: HY-1 anti-oxidation solder bar and HY-2 anti-oxidation solder bar from antioxidant capabilities. Our company offers variety choices of the alloy proportion of the solder bars for the customers.

Standard followed by our product: GB/T8012-2000

 ◇ HY-1 型抗氧化焊锡条    ◇ HY-1 anti-oxidation solder bar
在焊接温度300℃以下,液态焊料表妹如镜面光亮,出渣量少、防氧化效果佳;焊点光亮、致密、美观、可焊性好。被广泛应用于电子产品PCB组装的波峰焊和热浸焊(推荐波峰焊锡缸温度控制在 250℃±5℃、热浸焊锡缸温度 260℃±5℃),太阳能电池板组件互连带、汇流带的热涂锡。常用合金成分 Sn60A、Sn63A。
When the soldering temperature is below 300℃, the melting solder of HY-1 is ensured a bright surface as a mirror, fewer slag, excellent anti-oxidation performance, sound dense joint and good weldability, which it is widely used in electronic products, such as wave soldering and hot dip tinning/soldering of PCB(wave soldering tank temperature recommended maintaining at 250℃±5℃, hot dip solder cylinder temperature at 260℃±5℃) and component interconnect with solar panels, the bus thermal coated with tin, Common alloy composition is Sn60A or Sn62A.
 ◇ HY-2型抗氧化焊锡条    ◇ HY-2 anti-oxidation solder bar
HY-2型焊锡条为高温抗氧化焊锡条,锡液温度在420℃高温下,锡液表面呈银白色清洁光亮,适用于波峰焊、热浸焊钎焊工艺,特别适用于各种变压器制造时的自容漆包线搪锡。
Type HY-2 solder bar is high temperature anti-oxidation solder, At the temperature of 420℃, the melting solder of HY-2 is ensured a bright surface as silvery-white, clean and bright, which it is suitable for wave soldering, hot dip tinning/soldering, especially for tinning of autolysis of enameled wire of the manufacturing of various transformers.
 ☆ 低温焊料合金    ☆ Low temperature solder alloys
本公司具有生产29~179℃熔点范围内的上百款低温合金制造技术,其熔点或熔点范围精确,已广泛应用于温度控制器、热敏元器件、消防报警器、金属弯曲填充合金(可反复适用)、空调热过载保护期、电子产品的分阶段焊接(二次钎焊)、液态金属散热器等产品的制造。低熔点合金有丝、条、片、带、环等供应,特殊形状可来图纸洽谈定制。
Our company possess the manufacturing technologies for hunreds of low-temperature alloys within the range of 29~179℃. The melting point or melting range of the alloy can be controlled accurately, which they have benn widely used in soldering and/or manufacturing temperature controller, thermal components, fire alarm, metal bending filler alloy (available repeated use), thermal overloard protection device for air conditioner, step soldering for electronic products, (secondary soldering), liquid metal radiators and other products. Our company can provide all kinds of low-melting alloys, such as wire, strip, sheet, strip, ring, etc. Special shape solder can be customized according to drawings.

锡铅合金种类及供应形态
Type of Sn-Pb Solder Alloy and Offering Conditions
型号 合金成分
wt ℃
熔点℃
可供应产品形态 适用工艺
锡条 锡丝 锡膏 成型锡
Sn63A Sn63Pb
37A
183 波峰焊、
浸焊
热涂、
SMT锡膏
Sn60A Sn60Pb
40A
183-
190
  波峰焊、
浸焊
热涂、
SMT 锡膏
Sn55A Sn55Pb
45A
183-
203
  浸焊、
手工焊
Sn50A Sn50Pb
50A
183-
215
  浸焊、
手工焊
Sn45A Sn45Pb
55A
183-
227
  浸焊、
手工焊
型号 合金成分
wt ℃
熔点℃
可供应产品形态 适用工艺
锡条 锡丝 锡膏 成型锡
Sn40A Sn40Pb
60A
183-
238
  浸焊、
手工焊
Sn35A Sn35Pb
65A
183-
248
  手工焊
Sn30A Sn30Pb
70A
183-
258
  机器焊、
手工焊
Sn25A Sn25Pb
75A
183-
266
  机器焊、
手工焊
Sn20A Sn20Pb
80A
183-
279
  机器焊、
手工焊
型号 合金成分
wt ℃
熔点℃
可供应产品形态 适用工艺
锡条 锡丝 锡膏 成型锡
Sn15A Sn15Pb
85A
227-
288
  机器焊、
手工焊
Sn10A Sn10Pb
90A
268-
301
  手工焊、
机器焊
Sn5A Sn5Pb
95A
300-
311
  手工焊、
机器焊
Sn62Ag Sn62Pb
36Ag2
179-
190
SMT 锡膏
Sn10Ag Sn10Pb
88Ag2
268-
299
SMT高温
焊锡膏

表中带☆为我公司可供产品,特殊成分及形态请致电我公司垂询

☆ in this table means that the product is available by our company. Special ingredients and forms, or If you have any question, please call us.